Dynamic Flex Circuit for Camera With Moveable Image Sensor

ABSTRACT

Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

This application is a continuation-in-part of, and claims benefit ofpriority to, U.S. patent application Ser. No. 17/025,957, filed Sep. 18,2020, titled “Dynamic Flex Circuit for Camera With Moveable ImageSensor”, which claims benefit of priority to U.S. ProvisionalApplication No. 62/906,038, filed Sep. 25, 2019, titled “Dynamic FlexCircuit for Camera With Moveable Image Sensor”, each of which is herebyincorporated by reference in its entirety.

BACKGROUND Technical Field

This disclosure relates generally to a dynamic flex circuit for a camerawith a moveable image sensor.

Description of the Related Art

The advent of small, mobile multipurpose devices such as smartphones andtablet or pad devices has resulted in a need for high-resolution, smallform factor cameras for integration in the devices. Some cameras mayincorporate optical image stabilization (OIS) mechanisms that may senseand react to external excitation/disturbance by adjusting location ofthe optical lens on the X and/or Y axis in an attempt to compensate forunwanted motion of the lens. Furthermore, some cameras may incorporatean autofocus (AF) mechanism whereby the object focal distance can beadjusted to focus an object plane in front of the camera at an imageplane to be captured by the image sensor. In some such AF mechanisms,the optical lens is moved as a single rigid body along the optical axisof the camera to refocus the camera.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic block diagram of some components of anexample camera with a moveable image sensor, and a perspective view ofan example dynamic flex circuit that may be used with the moveable imagesensor, in accordance with some embodiments.

FIG. 2 illustrates a perspective view of portions of an example camerathat includes a dynamic flex circuit that may be used with a moveableimage sensor, in accordance with some embodiments.

FIGS. 3-4 illustrate perspective views of an example dynamic flexcircuit for a camera with a moveable image sensor, in accordance withsome embodiments. FIG. 3 shows the dynamic flex circuit in an exampleflat state. FIG. 4 shows the dynamic flex circuit in an example foldedstate.

FIG. 5 illustrates an example reinforcement arrangement for reinforcingone or more portions of a dynamic flex circuit in a camera with amoveable image sensor, in accordance with some embodiments.

FIG. 6 illustrates a side view of an example reinforcement layer thatmay be used in a reinforcement arrangement for reinforcing one or moreportions of a dynamic flex circuit in a camera with a moveable imagesensor, in accordance with some embodiments.

FIGS. 7A-7B illustrate views of an example reinforcement arrangement forreinforcing one or more portions of a dynamic flex circuit in a camerawith a moveable image sensor, in accordance with some embodiments. FIG.7A shows a perspective view of the dynamic flex circuit with thereinforcement arrangement. FIG. 7B shows a side view of a portion of thedynamic flex circuit that is reinforced with a reinforcement layer.

FIG. 8 illustrates cross-sectional views of three different options fora dynamic flex circuit that may be used in a camera with a moveableimage sensor, in accordance with some embodiments.

FIG. 9 illustrates a perspective view of the dynamic flex circuit with areinforcement arrangement, in accordance with some embodiments.

FIG. 10 illustrates a cross-sectional view of a portion of a dynamicflex circuit that is coupled with a reinforcement layer, in accordancewith some embodiments.

FIG. 11 illustrates a block diagram of a portable multifunction devicethat may include a dynamic flex circuit for a camera with a moveableimage sensor, in accordance with some embodiments.

FIG. 12 illustrates a portable multifunction device that may include adynamic flex circuit for a camera with a moveable image sensor, inaccordance with some embodiments.

FIG. 13 illustrates an example computer system that may include adynamic flex circuit for a camera with a moveable image sensor, inaccordance with some embodiments.

This specification includes references to “one embodiment” or “anembodiment.” The appearances of the phrases “in one embodiment” or “inan embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

“Comprising.” This term is open-ended. As used in the appended claims,this term does not foreclose additional structure or steps. Consider aclaim that recites: “An apparatus comprising one or more processor units. . . .” Such a claim does not foreclose the apparatus from includingadditional components (e.g., a network interface unit, graphicscircuitry, etc.).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” is used to connote structure by indicatingthat the units/circuits/components include structure (e.g., circuitry)that performs those task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. § 112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configure to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

“First,” “Second,” etc. As used herein, these terms are used as labelsfor nouns that they precede, and do not imply any type of ordering(e.g., spatial, temporal, logical, etc.). For example, a buffer circuitmay be described herein as performing write operations for “first” and“second” values. The terms “first” and “second” do not necessarily implythat the first value must be written before the second value.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While in this case, B is a factor that affects the determination of A,such a phrase does not foreclose the determination of A from also beingbased on C. In other instances, A may be determined based solely on B.

It will also be understood that, although the terms first, second, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first contact could be termed asecond contact, and, similarly, a second contact could be termed a firstcontact, without departing from the intended scope. The first contactand the second contact are both contacts, but they are not the samecontact.

The terminology used in the description herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting. As used in the description and the appended claims, thesingular forms “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willalso be understood that the term “and/or” as used herein refers to andencompasses any and all possible combinations of one or more of theassociated listed items. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

As used herein, the term “if” may be construed to mean “when” or “upon”or “in response to determining” or “in response to detecting,” dependingon the context. Similarly, the phrase “if it is determined” or “if [astated condition or event] is detected” may be construed to mean “upondetermining” or “in response to determining” or “upon detecting [thestated condition or event]” or “in response to detecting [the statedcondition or event],” depending on the context.

DETAILED DESCRIPTION

Various embodiments described herein relate to a flex circuit (alsoreferred to herein as a “dynamic flex circuit”) that may be used in acamera with a moveable image sensor. In some examples, the camera mayinclude the dynamic flex circuit, a stationary flex circuit, a moveableimage sensor, an actuator, and/or one or more optical elements. Theimage sensor may be configured to capture light that has passed throughthe optical element(s). The actuator may be configured to move the imagesensor relative to the optical element(s), e.g., so as to provideautofocus (AF) and/or optical image stabilization (OIS) functionality.Additionally, or alternatively, the actuator may be configured to moveone or more of the optical element(s) relative to the image sensor,e.g., so as to provide AF and/or OIS functionality. In some non-limitingexamples, the actuator may be configured to move the image sensororthogonal to a plane defined by the image sensor. Additionally, oralternatively, the actuator may be configured to move the image sensorparallel to the plane defined by the image sensor.

In various embodiments, the dynamic flex circuit may include one or morefixed end portions, a moveable end portion, and an intermediate portion.The fixed end portions may be connected to the stationary flex circuit.The moveable end portion may be coupled with the image sensor such thatthe moveable end portion moves with (e.g., in lockstep with) the imagesensor. The intermediate portion may extend from each of the fixed endportions to the moveable end portion. The intermediate portion may beconfigured to allow the moveable end portion to move (e.g., with theimage sensor) relative to the fixed end portions. In some embodiments,the dynamic flex circuit may be configured to convey electrical signals(e.g., power and/or control signals) along at least a portion of anelectrical connection path between the stationary flex circuit and themoveable image sensor. As will be discussed herein with reference toFIGS. 1-10, the intermediate portion of the dynamic flex circuit mayinclude one or more straight regions and one or more bend regions.

In some embodiments, the dynamic flex circuit may be subjected to highstrain and/or cyclic loading conditions. As discussed herein withreference to FIGS. 5-7B, a reinforcement arrangement may be used toreduce stress and strain at the bend region(s). Additionally, oralternatively, one or more of the straight regions of the dynamic flexcircuit may be designed with sufficient service loop to reduce stressand strain at the bend region(s). Additionally, or alternatively, thebend radii of the bend regions may be designed to reduce stress andstrain at the bend regions.

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the following detaileddescription, numerous specific details are set forth in order to providea thorough understanding of the present disclosure. However, it will beapparent to one of ordinary skill in the art that some embodiments maybe practiced without these specific details. In other instances,well-known methods, procedures, components, circuits, and networks havenot been described in detail so as not to unnecessarily obscure aspectsof the embodiments.

As mentioned above, various embodiments include a dynamic flex circuitfor a camera with a moveable image sensor. FIG. 1 shows a schematicblock diagram of some components a camera 100 including an example ofsuch a dynamic flex circuit 102. Furthermore, FIG. 1 shows a perspectiveview of the dynamic flex circuit 102. The example X-Y-Z coordinatesystem shown in FIG. 1 is used to discuss aspects of components and/orsystems, and may apply to embodiments described throughout thisdisclosure.

According to various embodiments, the camera 100 may include the dynamicflex circuit 102, a stationary flex circuit 104 (e.g., a flex circuit ofa module of the camera 100), a moveable image sensor 106, one or moreactuators 108, one or more optical elements 110, and/or a suspensionarrangement 112. The image sensor 106 may be configured to capture lightthat has passed through the optical element(s) 110. The actuator(s) 108may be configured to move the image sensor 106 relative to the opticalelement(s) 110, e.g., to provide AF and/or OIS functionality.Additionally, or alternatively, the actuator(s) 108 may be configured tomove one or more of the optical element(s) 110 relative to the imagesensor 106, e.g., to provide AF and/or OIS functionality. In somenon-limiting examples, the actuator(s) 108 may be configured to move theimage sensor 106 orthogonal to a plane defined by the image sensor 106(e.g., movement in the Z-axis direction). Additionally, oralternatively, the actuator(s) 108 may be configured to move the imagesensor 106 parallel to the plane defined by the image sensor 106 (e.g.,movement in the X-Y plane directions).

In various embodiments, the dynamic flex circuit 102 may include one ormore fixed end portions 114, one or more moveable end portions 116,and/or one or more intermediate portions 118. As indicated in theperspective view of the dynamic flex circuit 102 in FIG. 1, in somenon-limiting examples the dynamic flex circuit 102 may include fixed endportions 114(a) and 114(b), a moveable end portion 116, and anintermediate portion 118. The fixed end portions 114(a) and 114(b) maybe connected to the stationary flex circuit 104. The moveable endportion 116 may be coupled with the image sensor 106 such that themoveable end portion 116 moves with (e.g., in lockstep with) the imagesensor 106. The intermediate portion 118 may extend from each of thefixed end portions 114(a) and 114(b) to the moveable end portion 116.The intermediate portion 118 may be configured to allow the moveable endportion 116 to move (e.g., with the image sensor 106) relative to thefixed end portions 114(a) and 114(b). In some embodiments, the dynamicflex circuit 102 may be configured to convey electrical signals (e.g.,power and/or control signals) along at least a portion of an electricalconnection path between the stationary flex circuit 104 and the moveableimage sensor 106.

In some embodiments, the fixed end portions 114(a) and 114(b) of thedynamic flex circuit 102 may be fixedly attached to the stationary flexcircuit 104 (which may be considered a stationary structure) and/orfixedly attached to another stationary structure (e.g., stationarystructure 208 in FIG. 2) of the camera 100. For example, the fixed endportions 114(a) and 114(b) may be attached to one or more stationarystructures, and an electrical connection may be provided between thefixed end portions 114(a) and 114(b) and the stationary flex circuit 104via the stationary structure(s). In some embodiments, each of the fixedend portions 114(a) and 114(b) may have a first side that is attached tothe stationary flex circuit 104 and a second side (e.g., opposite thefirst side) that is attached to another stationary structure.

According to some embodiments, fixed end portion 114(a) and/or fixed endportion 114(b) of the dynamic flex circuit 102 may comprise a respectiveelectrical connection pad (e.g., an exposed copper pad) that may beelectrically connected (e.g., via hot-bar soldering) to a correspondingelectrical connection component of the stationary flex circuit 104. Insome embodiments, fixed end portion 114(a) and/or fixed end portion114(b) may define a respective plane that is orthogonal to a respectiveplane defined by the moveable end portion 116 and/or the image sensor106, e.g., as indicated in FIG. 1. However, it is contemplated that, insome embodiments, fixed end portion 114(a) and/or fixed end portion114(b) may define a respective plane that is oriented differently (e.g.,parallel to) relative to a respective plane defined by the moveable endportion 116 and/or the image sensor 106.

In various embodiments, the moveable end portion 116 of the dynamic flexcircuit 102 may be coupled with the image sensor 106. For example, theimage sensor 106 may be attached to (or otherwise coupled with) asubstrate (e.g., substrate 206 in FIG. 2) of the camera 100, and themoveable end portion 116 may be attached to the substrate. In someembodiments, the moveable end portion 116 may be electrically connectedto the image sensor 106 via the substrate and/or one or more otherintervening components.

According to various embodiments, the intermediate portion 118 of thedynamic flex circuit 102 may extend from the moveable end portion 116 toeach of the fixed end portions 114(a) and 114(b). The intermediateportion 118 may include one or more straight regions and/or one or morebend regions. As indicated in FIG. 1, in some non-limiting examples, theintermediate portion 118 may include a first straight region 120(a), asecond straight region 120(b), a third straight region 120(c), and/or afourth straight region 120(d). Furthermore, the intermediate portion 118may include a first bend region 122(a), a second bend region 122(b),and/or a third bend region 122(c). The first bend region 122(a) mayinterconnect the first straight region 120(a) with the second straightregion 120(b). The second bend region 122(b) may interconnect the secondstraight region 120(b) with the third straight region 120(c). The thirdbend region 122(c) may interconnect the second straight region 120(b)with the fourth straight region 120(c). According to some examples, apair of adjacent straight regions (e.g., the first straight region120(a) and the second straight region 120(b)) may be positioned at arespective non-zero bend angle (e.g., 90 degrees) with respect to eachother so as to comprise a bend via a bend region (e.g., the first bendregion 122(a)). In various embodiments, the bend angle may changeslightly as the image sensor 106 is moved, but the bend may be presentthrough the entire potential range of motion of the image sensor 106. Insome non-limiting examples, the bend angle may be within a range of 45degrees to 135 degrees. In some other non-limiting examples, the bendangle may be within a range of 60 degrees and 120 degrees.

In some embodiments, the first straight region 120(a) may define a planethat is parallel to the X-Y plane, and may have a longest dimensionextending in the X-axis direction from the moveable end portion 116 tothe first bend region 122(a). The second straight region 120(b) maydefine a plane that is parallel to the Y-Z plane, and may have a longestdimension extending in the Y-axis direction from the second bend region122(b) to the third bend region 122(c). The third straight region 120(c)may define a plane that is parallel to the X-Z plane, and may have alongest dimension extending in the X-axis direction from the second bendregion 122(b) to fixed end portion 114(a). The fourth straight region120(d) may define a plane that is parallel to the X-Z plane, and mayhave a longest dimension extending in the X-axis direction from thethird bend region 122(c) to fixed end portion 114(b). As indicated inFIG. 1, the dynamic flex circuit 102 may be symmetrical (e.g., about aplane that is parallel to the X-Z plane). However, the dynamic flexcircuit 102 may be asymmetrical about one or more planes that areparallel to the X-Z plane, the Y-Z plane, and/or X-Z plane.

According to some embodiments, the longest dimension of the firststraight region 120(a) may be sized so as to reduce stiffness of thedynamic flex circuit 102 in the Z-axis direction, e.g., to allowmovement of the moveable end portion 116 in the Z-axis direction. Thelongest dimension of the second straight region 120(b) may be sized soas to reduce stiffness of the dynamic flex circuit 102 in the X-axisdirection, e.g., to allow movement of the moveable end portion 116 inthe X-axis direction. The longest dimension of the third straight region120(c) may be sized so as to reduce stiffness of the dynamic flexcircuit 102 in the Y-axis direction, e.g., to allow movement of themoveable end portion 116 in the Y-axis direction. Similarly, the longestdimension of the fourth straight region 120(d) may be sized so as toreduce stiffness of the dynamic flex circuit 102 in the Y-axisdirection, e.g., to allow movement of the moveable end portion 116 inthe Y-axis direction.

In some embodiments, the first bend region 122(a) may be a region atwhich the dynamic flex circuit 102 bends about a first axis. The secondbend region 122(b) may be a region at which the dynamic flex circuit 102bends about a second axis. The third bend region 122(c) may be a regionat which the dynamic flex circuit 102 bends about a third axis. In someembodiments, one or more of the axes may intersect one or more of theother axes. In some non-limiting examples, the first axis (correspondingto the first bend region 122(a)) may intersect the second axis(corresponding to the second bend region 122(b)) and/or the third axis(corresponding to the third bend region 122(c)). In some non-limitingexamples, the first axis may be orthogonal to each of the second axisand the third axis. Furthermore, in some embodiments, one or more of theaxes may be parallel to one or more of the other axes. In somenon-limiting examples, the second axis may be parallel to the thirdaxis. According to some non-limiting examples, the first axis may beparallel to the Y-axis (and/or parallel to a respective plane defined bythe moveable end portion 116 and/or the image sensor 106), the secondaxis may be parallel to the Z-axis (and/or orthogonal to the respectiveplane defined by the moveable end portion 116 and/or the image sensor106), and/or the third axis may be parallel to the Z-axis (and/ororthogonal to the respective plane defined by the moveable end portion116 and/or the image sensor 106).

In some embodiments, one or more of the straight regions and/or the bendregions of the dynamic flex circuit 102 may split, at least in part,into multiple “legs.” As a non-limiting example, a portion of the firststraight region 120(a) may split into two legs 124(a) and 124(b) thatextend in parallel from a wider portion 126 of the first straight region120(a) to the first bend region 122(a), e.g., as indicated in FIG. 1. Insome examples, the first bend region 122(a) may split into twocorresponding legs 128(a) and 128(b) that connect with legs 124(a) and124(b), respectively. In some embodiments, the wider portion 126 of thefirst straight region 120(a) may provide a fan-out space for electricalsignal traces (not shown) routed from the moveable end portion 116 tofixed end portion 114(a) and/or fixed end portion 114(b). For example,one or more electrical signal traces may be routed along the followingpath: from the moveable end portion 116 to the wider portion 126 of thefirst straight region 120(a), from the wider portion 126 to leg 124(a)of the first straight region 120(a), from leg 124(a) to correspondingleg 128(a) of the first bend region 122(a), from corresponding leg128(a) to second straight region 120(b) in a first direction to thesecond bend region 122(b) (e.g., through a segment of the secondstraight region 120(b) that extends from its connection to the firstbend region 122(a) to its connection to the second bend region 122(b)),from the second bend region 122(b) to fixed end portion 114(a).Additionally, or alternatively, one or more electrical signal traces maybe routed along the following path: from the moveable end portion 116 tothe wider portion 126 of the first straight region 120(a), from thewider portion 126 to leg 124(b) of the first straight region 120(a),from leg 124(b) to corresponding leg 128(b) of the first bend region122(a), from corresponding leg 128(b) to second straight region 120(b)in a second direction (e.g., opposite the first direction) to the thirdbend region 122(c) (e.g., through another segment of the second straightregion 120(b) that extends from its connection to the first bend region122(a) to its connection to the third bend region 122(c)), and from thethird bend region 122(c) to fixed end portion 114(b).

In some embodiments, the number, type(s), size(s), and/or arrangement ofelectrical signal traces that are routed via leg 124(a) may be the sameas, or may differ from, those routed via leg 124(b). In variousnon-limiting examples, electrical signal traces and/or dummy traces(e.g., elements that do not actually convey electrical signals) may bedistributed between the legs 124(a) and 124(b) such that symmetry ofweight is maintained, e.g., about a plane defining symmetry of geometryof the dynamic flex circuit 102.

According to some embodiments, a portion of the wider portion 126 may beused to provide a surface area for attachment of the moveable endportion 116 to one or more components (e.g., to the substrate via anadhesive), e.g., to couple the dynamic flex circuit 102 with the imagesensor 106. Additionally, or alternatively, the moveable end portion 116may provide surface area for the same (or similar) attachment. In somenon-limiting examples, the moveable end portion 116 may loop around aperiphery edge portion of the substrate and/or another component that iscoupled with the image sensor 106.

As discussed above, the camera 100 may include actuator(s) 108 and/or asuspension arrangement 112. In some non-limiting examples, theactuator(s) may comprise a voice coil motor (VCM) actuator. The VCMactuator may include one or more magnets and one or more coils. Themagnet(s) and coil(s) may magnetically interact to produce Lorentzforces that move the image sensor 106, e.g., to provide AF and/or OISfunctionality. However, the actuator(s) 108 may include any otheractuator suitable for moving the image sensor 106. In variousembodiments, the suspension arrangement 112 may be configured to suspendthe image sensor 106 from one or more stationary structures (e.g., basestructure 210 in FIG. 2). Furthermore, the suspension arrangement 112may be configured to allow movement of the image sensor 106, e.g., inaccordance with movement caused by the actuator(s) 108. In somenon-limiting examples, the suspension arrangement 112 may include one ormore flexures (e.g., leaf spring(s), suspension wire(s), flexure arm(s),etc.) and/or bearings (e.g., ball bearings), etc.

According to some embodiments, the optical element(s) 110 may include alens group. For example, the lens group may include one or more lenselements that define an optical axis. In some embodiments, the opticalelement(s) 100 may additionally, or alternatively, include one or morelight-folding elements (e.g., a prism, a mirror, etc.) configured tofold a path of light before the light reaches the image sensor 106. Assuch, the camera 100 may be considered to have a folded opticsarrangement that folds a path of light one or more instances beforereaching the image sensor 106. In some embodiments, a folded opticsarrangement may provide spaces at certain locations that enablespace-efficient inclusion of the dynamic flex circuit 102. As anon-limiting example, at least part of the intermediate portion 118 maybe disposed within a space below a light-folding element and/or below alens group without increasing the Z-axis dimension of the camera 100. Insome embodiments, the camera 100 may not include light-folding elements.

As discussed above, in some examples, the actuator(s) 108 may beconfigured to move one or more of the optical element(s) 110 relative tothe image sensor 106. Furthermore, the actuator(s) 108 may be configuredto move the image sensor 106 relative to the optical element(s) 110. Ina non-limiting example, the optical element(s) 110 may include a lensgroup and one or more light-folding elements. The actuator(s) 108 may beconfigured to move the lens group and/or the light-folding element(s)relative to the image sensor 106, e.g., so as to provide AFfunctionality. Furthermore, the actuator(s) 108 may be configured tomove the image sensor 106 relative to the optical element(s) 110, e.g.,so as to provide OIS functionality. According to some non-limitingexamples, the number of bend regions and/or straight regions of thedynamic flex circuit 102 may be reduced in embodiments where the numberof movement axes of the image sensor 106 is reduced, e.g., by having theactuator(s) 108 move one or more of the optical element(s) 110 relativeto the image sensor 106 for AF and/or OIS in addition to having theactuator(s) 108 move the image sensor 106 for AF and/or OIS.

FIG. 2 illustrates a perspective view of portions of an example camera200 that includes a dynamic flex circuit 202 that may be used with amoveable image sensor 204. In some embodiments, aspects of the camera200 may be the same as (or similar to) aspects of the camera 100described herein with reference to FIG. 1. In some embodiments, aspectsof the dynamic flex circuit 202 may be the same as (or similar to)aspects of one or more of the dynamic flex circuits described hereinwith reference to FIGS. 1 and 3-6. For simplicity of discussion, theterms used to describe portions of the dynamic flex circuit 100 of FIG.1 will be used herein to reference portions of the dynamic flex circuit200 of FIG. 2.

According to some embodiments, the camera 200 may include the dynamicflex circuit 202, an image sensor 204, a substrate 206, and one or morestationary structures (e.g., stationary structure 208, base structure210, etc.). The image sensor 204 may be attached to the substrate 206and/or one or more other components, such as a moveable platform of asuspension arrangement of the camera 200.

In some embodiments, the dynamic flex circuit 202 may include the fixedend portions 114(a) and 114(b), the intermediate portion 118, and themoveable end portion 116 (obstructed from the reader's view by othercomponents in FIG. 2). The fixed end portions 114(a) and 114(b) may beattached to the stationary structure 208. In some embodiments, thestationary structure 208 may comprise the stationary flex circuit 104described herein with reference to FIG. 1. Additionally, oralternatively, the stationary structure 208 may provide an electricalconnection between the stationary flex circuit 104 and each of the fixedend portions 114(a) and 114(b) of the dynamic flex circuit 202. In someembodiments, the moveable end portion 116 may be attached to thesubstrate 206 and/or otherwise coupled with the image sensor 204. As anon-limiting example, the moveable end portion 116 may be attached to afirst side of the substrate 206, and the image sensor 204 may beattached to a second side (e.g., opposite the first side) of thesubstrate 206.

According to some embodiments, one or more portions of the dynamic flexcircuit 202 may extend along (and/or proximate to) one or morerespective sides of the camera 200, e.g., for the efficient use ofspace. For example, as indicated in FIG. 2, the moveable end portion 116and the first straight portion 120(a) may extend along a first side(e.g., an upper or lower side) of the camera 200, the second straightportion 120(b) may extend along a second side of the camera 200, thethird straight portion 120(c) may extend along a third side of thecamera 200, and the fourth straight portion 120(d) may extend along afourth side (e.g., opposite the third side) of the camera 200. The firstside may be orthogonal to the second side, the third side, and/or thefourth side.

FIGS. 3-4 illustrate perspective views of an example dynamic flexcircuit 300 for a camera with a moveable image sensor. FIG. 3illustrates an example of the dynamic flex circuit 300 in a flat state.FIG. 4 illustrates an example of folding the dynamic flex circuit 300into a folded state. In some embodiments, aspects of the dynamic flexcircuit 300 may be the same as (or similar to) aspects of one or more ofthe dynamic flex circuits described herein with reference to FIGS. 1-2and 5-6. For simplicity of discussion, the terms used to describeportions of the dynamic flex circuit 100 of FIG. 1 will be used hereinto reference portions of the dynamic flex circuit 300 of FIGS. 3-4.

In some embodiments, the dynamic flex circuit 300 may be formed to aparticular flat pattern (e.g., the flat pattern shown in FIG. 3) that issuitable for folding into the folded state shown in FIG. 4. In somenon-limiting embodiments, the dynamic flex circuit 300 may formed byetching or otherwise cutting flex circuit material(s) into theparticular flat pattern.

In some non-limiting embodiments, the dynamic flex circuit 300 may betransformed from the flat state to a folded state by folding the dynamicflex circuit 300 one or more times, e.g., as indicated in FIG. 4. Insome embodiments, the dynamic flex circuit 300 may be folded at thefirst bend region 122(a), e.g., as indicated by arrows 402.Additionally, or alternatively, the dynamic flex circuit 300 may befolded at the second bend region 122(b), e.g., as indicated by arrow404. Additionally, or alternatively, the dynamic flex circuit 300 may befolded at the third bend region 122(c), e.g., as indicated by arrow 406.It should be understood, however, that the dynamic flex circuit 300 maybe folded at fewer or more locations, by varying degrees, and/or indifferent orientations than indicated in FIG. 4. Furthermore, the orderof folding the dynamic flex circuit 300 may be different in variousembodiments.

FIG. 5 illustrates an example reinforcement arrangement for reinforcingone or more portions of a dynamic flex circuit 500 in a camera with amoveable image sensor. In some embodiments, aspects of the dynamic flexcircuit 500 may be the same as (or similar to) aspects of one or more ofthe dynamic flex circuits described herein with reference to FIGS. 1-4and 6. According to various embodiments, the reinforcement arrangement502 may include one or more bend regions of the dynamic flex circuit 500that are locally widened relative to one or more adjacent straightregions of the dynamic flex circuit 500. Additionally, or alternatively,the reinforcement arrangement 502 may include one or more additionallayers of material attached to the dynamic flex circuit 500 at one ormore bend regions. In some embodiments, the dynamic flex circuit 500 maybe subjected to high strain and/or cyclic loading conditions, and thereinforcement arrangement 502 may reduce stress and strain at the bendregion(s). According to some embodiments, at least a portion of thereinforcement arrangement 502 (e.g., comprising one or more additionallayers of material attached to the dynamic flex circuit 500 at one ormore bend regions may additionally, or alternatively, be used forretaining a bend shape of the dynamic flex circuit 500 at the bendregion(s).

In some embodiments, the dynamic flex circuit 500 may include fixed endportions 504(a) and 504(b), intermediate portion 506, and moveable endportion 508. The intermediate portion 506 may include a first straightregion 510(a), a second straight region 510(b), a third straight region510(c), and a fourth straight region 510(d). As indicated in FIG. 5, oneor more of the straight regions 510(a)-(d) may be split, at least inpart, into multiple legs, e.g., by forming one or more slots in thestraight region(s).

According to various embodiments, the dynamic flex circuit 500 maycomprise one or more flex circuit materials. As a non-limiting example,the dynamic flex circuit 500 may comprise composite layers of polyimide(PI), adhesive, and copper. In some embodiments, the reinforcementarrangement 502 may include a contiguous strip of at least one of theflex circuit materials that is wider at a bend region than respectivecontiguous strips of the flex circuit material(s) at one or moreadjacent straight regions. For example, FIG. 5 indicates that a locallywidened contiguous strip 512 that is wider than a contiguous strip 514at an adjacent straight region. In some embodiments, the locally widenedcontiguous strip 512 may be formed by splitting the adjacent straightregion(s) into multiple legs, e.g., as indicated in FIG. 5.Additionally, or alternatively, the locally widened contiguous strip 512may be formed by including one or more protruding portions 512′ (e.g.,protruding above and/or below the bend region) that increase the widthat the bend region relative to the adjacent straight region(s).

In some embodiments, the reinforcement arrangement 502 may additionally,or alternatively, include one or more additional layers of material 516attached to the dynamic flex circuit 500 at one or more bend regions.For example, as shown in FIGS. 5-6, an additional layer of material 516(e.g., PI, aluminum, stainless steel, etc.) may be attached to the flexcircuit material(s) at a bend region such that at least a portion of thebend region is thicker than one or more adjacent straight regions. Asindicated above, the additional layer of material 516 may additionally,or alternatively, be used for retaining the bend shape of the dynamicflex circuit 500 at the bend region. In some embodiments, one or more ofthe additional layers of material 516 may be attached to the dynamicflex circuit 500 with adhesive. Additionally, or alternatively, one ormore of the additional layers of material 516 may be provided on theflex circuit 500, and portion(s) of the additional layer(s) of material516 may be etched away so as to only leave the additional layer(s) ofmaterial 516 at the bend region(s).

While the reinforcement arrangement 502 is illustrated with respect tocertain bend regions in FIG. 5, it should be understood that variouscombinations of locally widening and/or thickening (e.g., by addinglayer(s) of material) may be used with respect to one or more bendregions of the dynamic flex circuit 500.

In some embodiments, one or more of the straight regions 510(a)-510(d)may be designed with sufficient service loop to maintain low stress andstrain at one or more of the bend regions. Furthermore, the bend radiiof the bend regions may be designed to maintain low stress and strain atthe bend regions. In some non-limiting examples, a bend radius of a bendregion may be greater than or equal to three times the thickness of thedynamic flex circuit 500. In some non-limiting examples, the bend radiusof a bend region may be greater than or equal to five times thethickness of the dynamic flex circuit 500.

FIGS. 7A-7B illustrate views of an example reinforcement arrangement forreinforcing one or more portions of a dynamic flex circuit 700 in acamera with a moveable image sensor. FIG. 7A shows a perspective view ofthe dynamic flex circuit 700 with the reinforcement arrangement 702.FIG. 7B shows a side view of a portion of the dynamic flex circuit 700that is reinforced with a reinforcement layer. In some embodiments,aspects of the dynamic flex circuit 700 may be the same as (or similarto) aspects of one or more of the dynamic flex circuits described hereinwith reference to FIGS. 1-6.

In some embodiments, the dynamic flex circuit 700 may include fixed endportions 704(a) and 704(b), intermediate portion 706, and moveable endportion 708. The intermediate portion 706 may include a first straightregion 710(a), a second straight region 710(b), a third straight region710(c), and a fourth straight region 710(d). According to variousembodiments, the dynamic flex circuit 700 may comprise one or more flexcircuit materials. As a non-limiting example, the dynamic flex circuit700 may comprise composite layers of polyimide (PI), adhesive, andcopper.

According to various embodiments, the reinforcement arrangement 702 mayinclude one or more additional layers of material (e.g.,additional/reinforcement layers of material 712, 714, and/or 716)coupled with the dynamic flex circuit 700 at one or more bend regions.For example, reinforcement layer of material 712 may be attached to thedynamic flex circuit 700 at a first bend region that extends from thefirst straight region 710(a) to the second straight region 710(b).Additionally, or alternatively, reinforcement layer of material 714 maybe attached to the dynamic flex circuit 700 at a second bend region thatextends from the second straight region 710(b) to the third straightregion 710(c). Additionally, or alternatively, reinforcement layer ofmaterial 716 may be attached to the dynamic flex circuit 700 at a thirdbend region that extends from the second straight region 710(b) to thefourth straight region 710(d). In various embodiments, a respectivereinforcement layer of material may be used to stiffen a respective bendregion relative to an unreinforced portion of one or more straightregions. For example, in FIG. 7A, the reinforcement layers of material712, 714, and 716 are spaced apart from each other by portions of thesecond straight region 710(b) that are not reinforced (or“unreinforced”) by any additional layers of material.

As indicated in FIG. 7B, reinforcement layer of material 712 may extendpast a footprint of the dynamic flex circuit 700. For example, thereinforcement layer of material 712 may include a first portion thatoverlaps with a surface of the dynamic flex circuit 700, and one or moreother portions that extend from the first portion past a footprint ofthe flex circuit, such that they do not overlap with the surface. Insome embodiments, the reinforcement layer of material 712 may include asecond portion that extends from the first portion past the footprint ofthe dynamic flex circuit 700 in a first direction, e.g., by a firstnon-overlapping distance 718. Additionally, or alternatively, thereinforcement layer of material 712 may include a third portion thatextends from the first portion past the footprint of the dynamic flexcircuit 700 in a second direction, e.g., by a second non-overlappingdistance 720.

By extending the reinforcement layer of material 712 past the footprintof the dynamic flex circuit 700 in this manner, stress concentrationsthat may otherwise be present in some other embodiments (e.g., where thereinforcement layer of material is contained within the footprint of aflex circuit) may be reduced. Furthermore, the second portion and/or thethird portion of the reinforcement layer of material 712 may be used asbumpers that limit or prevent contact between the dynamic flex circuit700 and the rest of the camera during sensor shift actuation and shockevents. Furthermore, the second portion and/or the third portion of thereinforcement layer of material 712 may reduced the risk of damage toedges of the dynamic flex circuit 700 and/or electrical traces in thedynamic flex circuit 700 during bending.

In some embodiments, the reinforcement layer of material 712 maycomprise plastic and/or a metallic alloy. As a non-limiting example, thereinforcement layer of material 712 may comprise a metallic alloy, suchas, but not limited to, aluminum, brass, or stainless steel.

While some examples described herein refer to the structure ofreinforcement layer of material 712, it should be appreciated thatreinforcement layers of material 714 and/or 716 may be similarlystructured in some embodiments.

FIG. 8 illustrates a cross-sectional view of a portion of an exampledynamic flex circuit 800 (e.g., dynamic flex circuit 700) that may beused in a camera with a moveable image sensor. In some non-limitingembodiments, the cross-sectional view in FIG. 8 may correspond to across-section taken at cross-section plane 722 indicated in FIG. 7.

According to some embodiments, the dynamic flex circuit 800 may includea stack of layers that enables a reduction in size relative to someother flex circuit stack-ups, such as stack-ups 802 and 804, thatinclude a coverlay, an adhesive layer, electrical traces, a dielectriclayer, and/or a shield layer arranged in the manner indicated in FIG. 8.The stack of layers of the dynamic flex circuit 800 may include adielectric coating layer 806 instead of the adhesive layer and/orinstead of the coverlay in the other stack-ups 802 and 804. In variousembodiments, the dielectric coating layer 806 may comprise aphotosensitive polyimide (PI) layer (e.g., a photosensitive liquid PIlayer). According to some non-limiting embodiments, use of thedielectric coating layer 806 may enable the stack of layers to have atotal thickness, in the stacking direction, that is less than 40microns.

As indicated in FIG. 8, the stack of layers of the dynamic flex circuit800 may include a dielectric layer 808 (e.g., a base PI layer) adjacentto the electrical traces 810 and the dielectric coating layer 806. Thedielectric layer 808 may comprise PI and/or a build-up film (e.g., a dryinsulation build-up film), etc. The electrical traces 810 may be formedof a conductive material (e.g., copper) and configured to conveyelectrical signals. In some embodiments, the dielectric coating layer806 may be adjacent the electrical traces 810 and the base PI layer 808.For example, the electrical traces 810 may be at least partiallyembedded within the dielectric coating layer 806, as indicated in FIG.8.

In some embodiments, one or more portions of the dynamic flex circuit800 may optionally include a shield layer 812. The shield layer 812 maybe an electromagnetic interference (EMI) shield layer for reducing EMIbetween the electrical signals (conveyed via the electrical traces 810)and components of the camera and/or external components that areexternal to the camera. In some embodiments, the shield layer 812 maycomprise silver (e.g., silver mesh shielding) and/or copper (e.g.,copper-sputtered shielding).

Furthermore, a reinforcement layer of material 814 (e.g., one or more ofthe reinforcement layers described herein with reference to FIGS. 5-7B,9, and 10) may optionally be coupled with one or more portions of thedynamic flex circuit 800 in some embodiments. In various examples, thereinforcement layer of material 814 may be coupled with the dynamic flexcircuit 800 at one or more bend regions.

In a non-limiting embodiment, the electrical traces 810 may have a tracethickness 816 in the stacking direction, and the dielectric coatinglayer 806 (e.g., comprising photosensitive liquid PI) may extend, in thestacking direction, above a top surface of the electrical traces 810 byan overlay thickness 818. In some non-limiting embodiments, a collectivethickness of the trace thickness 816 and the overlay thickness 818 maybe less than a collective thickness of the adhesive layer and coverlayin stack-up 802 and stack-up 804, as indicated in FIG. 8.

In some embodiments, use of the dielectric coating layer 806 in thedynamic flex circuit 800 may enable the stack of layers to have asmaller thickness relative to stack-up 802 and/or stack-up 804.Additionally, or alternatively, use of the dielectric coating layer 806in the dynamic flex circuit 800 may reduce thickness relative tostack-up 802 and/or stack-up 804, which may facilitate bending duringsensor shift actuation. The stiffness reduction may reduce the magneticforce required from the actuator, thus enabling a reduction in modulesize and/or power savings. Additionally, or alternatively, the reductionin thickness and/or stiffness provides design flexibility to make otherchanges to the stack of layers that may enable improved electrical tracerouting and/or improved signal integrity performance.

FIGS. 9-10 illustrate views of an example reinforcement arrangement forreinforcing one or more portions of a dynamic flex circuit 900 in acamera with a moveable image sensor. FIG. 9 shows a perspective view ofthe dynamic flex circuit 900 with the reinforcement arrangement 902.FIG. 10 shows a cross-sectional view of a portion 1000 of the dynamicflex circuit 900 that is coupled with a reinforcement layer. In somenon-limiting embodiments, the cross-sectional view in FIG. 10 maycorrespond to a cross-section taken at cross-section plane 904 indicatedin FIG. 9.

According to various embodiments, the reinforcement arrangement 902 mayinclude one or more additional layers of material (e.g.,additional/reinforcement layers of material 906, 908, and/or 910)coupled with the dynamic flex circuit 900 at one or more bend regions.For example, reinforcement layer of material 906 may be attached to thedynamic flex circuit 900 at a first bend region that extends from thefirst straight region 710(a) to the second straight region 710(b).Additionally, or alternatively, reinforcement layer of material 908 maybe attached to the dynamic flex circuit 900 at a second bend region thatextends from the second straight region 710(b) to the third straightregion 710(c). Additionally, or alternatively, reinforcement layer ofmaterial 910 may be attached to the dynamic flex circuit 700 at a thirdbend region that extends from the second straight region 710(b) to thefourth straight region 710(d). In various embodiments, a respectivereinforcement layer of material may be used to stiffen a respective bendregion relative to an unreinforced portion of one or more straightregions. For example, in FIG. 9, the reinforcement layers of material906, 908, and 910 are spaced apart from each other by portions of thesecond straight region 710(b) that are not reinforced (or“unreinforced”) by any additional layers of material.

According to some embodiments, one or more of the reinforcement layersof material 906, 908, and/or 910 may be integrally formed in a samestack of layers as the dynamic flex circuit 900. For example, asindicated in FIG. 10, the portion 1000 may comprise a stack of layersthat includes a reinforcement base layer 1002, a dielectric layer 1004,electrical traces 1006, an adhesive layer 1008, and/or a coverlay 1010in some embodiments.

In some embodiments, forming the stack of layers may include forming thedielectric layer 1004 adjacent the reinforcement base layer 1002.Furthermore, forming the stack of layers may include removing, using oneor more subtractive manufacturing processes (e.g., an etching process),portions of the reinforcement base layer 1002 to expose portions of thedielectric layer and to define an outer periphery of a reinforcementlayer of material (e.g., reinforcement layer of material 906) at a bendregion. The remaining reinforcement layer(s) of material may stiffen thebend region(s) relative to the portions of the dielectric layer thatwere exposed via the subtractive manufacturing process(es). While FIG.10 includes the adhesive layer 1008 and the coverlay 1010, it should beunderstood that forming the stack of layers may include coating theelectrical traces 1006 and the dielectric layer 1004 with a dielectriccoating layer (e.g., dielectric coating layer 806 in FIG. 8) instead ofincluding the adhesive layer 1008 and/or the coverlay 1010. For example,forming the stack of layers may include coating the electrical traces1006 and the dielectric layer 1004 with a photosensitive liquidpolyimide (PI) layer. The photosensitive liquid PI layer and thereinforcement base layer 1002 may be positioned on opposite sides of thedielectric layer 1004 in some embodiments.

According to some non-limiting embodiments, the reinforcement base layer1002 may be a metallic layer. For example, the reinforcement base layer1002 may comprise copper and/or stainless steel in some embodiments. Insome embodiments, the reinforcement base layer 1002 may have a totalthickness, in the stacking direction, ranging from 10 microns to 12microns. Whereas some other stack-ups may include a reinforcement layerthat is attached to a dielectric layer using an adhesive layer, thestack of layers of portion 1000 may not require an adhesive layerbetween the reinforcement base layer 1002 and the dielectric layer 1004,due to the reinforcement base layer 1002 being integrated with thedynamic flex circuit 900. This may enable a thickness reduction at thereinforced bend regions. Furthermore, the disclosed method of formingthe stack of layers may eliminate an assembly process step, as thereinforcement layer(s) do not have to be separately formed and attachedto the flex circuit 900 via an adhesive layer. Additionally, thedisclosed method of forming the stack of layers may reduce overallcomponent count for the dynamic flex circuit 900 with reinforcementlayers at one or more bend regions, which may decrease the manufacturingcost. In some embodiments, the disclosed method of forming the stack oflayers may provide less stiffness variability at the reinforcement 902(and/or the bend region(s)), which may enable improved positionalaccuracy during sensor shift actuation, relative to some other stack-upsthat include a reinforcement layer that is attached to a dielectriclayer using an adhesive layer.

While some examples described herein refer to the structure ofreinforcement layer of material 906, it should be appreciated thatreinforcement layers of material 908 and/or 910 may be similarlystructured in some embodiments. Furthermore, it should be understoodthat different types of reinforcement layers may be used to reinforcedifferent bend regions in some embodiments.

As indicated in FIG. 9, the first straight region 710(a) of the dynamicflex circuit 900 may be a first contiguous leg that extends, in a firstdirection parallel to an image plane defined by the image sensor, fromthe moveable end portion 708 to the first bend region. This firstcontiguous leg may be considered a “merged,” single-legged version ofthe split/double-legged embodiments shown in FIGS. 1-5. The secondstraight region 710(b) of the dynamic flex circuit 900 may be a secondcontiguous leg that extends, in a second direction different than thefirst direction, from the second bend region to the third bend region.According to some embodiments, the first bend region and the firststraight region 710(a) may be centered, in the second direction, betweenthe second bend region and the third bend region, e.g., as indicated inFIG. 9.

The first contiguous leg, in this merged form, may enable improveduniformity of stress and/or reduced stress concentrations in the dynamicflex circuit 900, e.g., during sensor shift actuation in X-axis and/orY-axis directions. Furthermore, the first contiguous leg, in this mergedform, may reduce vertical movement (e.g., in the Z-axis direction) ofthe legs of the dynamic flex circuit 900 during image sensor actuationin the Y-axis direction. Additionally, rather than using multiplereinforcement layers (e.g., one for each bend region of thesplit/double-legged embodiments, the first bend region may be coupledwith a single reinforcement layer due to the merged form of thecontiguous leg, thus reducing component count. Furthermore, the firstcontiguous leg, in this merged form, may allow for an increase in lengthof the other legs, in the X-direction and/or the Y-direction, which mayenable a reduction in stiffness and/or stress.

Multifunction Device Examples

Embodiments of electronic devices, user interfaces for such devices, andassociated processes for using such devices are described. In someembodiments, the device is a portable communications device, such as amobile telephone, that also contains other functions, such as PDA and/ormusic player functions. Example embodiments of portable multifunctiondevices include, without limitation, the iPhone®, iPod Touch®, and iPad®devices from Apple Inc. of Cupertino, Calif. Other portable electronicdevices, such as laptops, cameras, cell phones, or tablet computers, mayalso be used. It should also be understood that, in some embodiments,the device is not a portable communications device, but is a desktopcomputer with a camera. In some embodiments, the device is a gamingcomputer with orientation sensors (e.g., orientation sensors in a gamingcontroller). In other embodiments, the device is not a portablecommunications device, but is a camera.

In the discussion that follows, an electronic device that includes adisplay and a touch-sensitive surface is described. It should beunderstood, however, that the electronic device may include one or moreother physical user-interface devices, such as a physical keyboard, amouse and/or a joystick.

The device typically supports a variety of applications, such as one ormore of the following: a drawing application, a presentationapplication, a word processing application, a website creationapplication, a disk authoring application, a spreadsheet application, agaming application, a telephone application, a video conferencingapplication, an e-mail application, an instant messaging application, aworkout support application, a photo management application, a digitalcamera application, a digital video camera application, a web browsingapplication, a digital music player application, and/or a digital videoplayer application.

The various applications that may be executed on the device may use atleast one common physical user-interface device, such as thetouch-sensitive surface. One or more functions of the touch-sensitivesurface as well as corresponding information displayed on the device maybe adjusted and/or varied from one application to the next and/or withina respective application. In this way, a common physical architecture(such as the touch-sensitive surface) of the device may support thevariety of applications with user interfaces that are intuitive andtransparent to the user.

Attention is now directed toward embodiments of portable devices withcameras. FIG. 11 illustrates a block diagram of an example portablemultifunction device 1100 that may include a flex circuit for a camerawith a moveable image sensor (e.g., as described above with reference toFIGS. 1-10), according to some embodiments. Cameras 1164 are sometimescalled “optical sensors” for convenience, and may also be known as orcalled an optical sensor system. Device 1100 may include memory 1102(which may include one or more computer readable storage mediums),memory controller 1122, one or more processing units (CPUs) 1120,peripherals interface 1118, RF circuitry 1108, audio circuitry 1110,speaker 1111, touch-sensitive display system 1112, microphone 1113,input/output (I/O) subsystem 1106, other input or control devices 1116,and external port 1124. Device 1100 may include multiple optical sensors1164. These components may communicate over one or more communicationbuses or signal lines 1103.

It should be appreciated that device 1100 is only one example of aportable multifunction device, and that device 1100 may have more orfewer components than shown, may combine two or more components, or mayhave a different configuration or arrangement of the components. Thevarious components shown in FIG. 11 may be implemented in hardware,software, or a combination of hardware and software, including one ormore signal processing and/or application specific integrated circuits.

Memory 1102 may include high-speed random access memory and may alsoinclude non-volatile memory, such as one or more magnetic disk storagedevices, flash memory devices, or other non-volatile solid-state memorydevices. Access to memory 1102 by other components of device 1100, suchas CPU 1120 and the peripherals interface 1118, may be controlled bymemory controller 1122.

Peripherals interface 1118 can be used to couple input and outputperipherals of the device to CPU 1120 and memory 1102. The one or moreprocessors 1120 run or execute various software programs and/or sets ofinstructions stored in memory 1102 to perform various functions fordevice 1100 and to process data.

In some embodiments, peripherals interface 1118, CPU 1120, and memorycontroller 1122 may be implemented on a single chip, such as chip 1104.In some other embodiments, they may be implemented on separate chips.

RF (radio frequency) circuitry 1108 receives and sends RF signals, alsocalled electromagnetic signals. RF circuitry 1108 converts electricalsignals to/from electromagnetic signals and communicates withcommunications networks and other communications devices via theelectromagnetic signals. RF circuitry 1108 may include well-knowncircuitry for performing these functions, including but not limited toan antenna system, an RF transceiver, one or more amplifiers, a tuner,one or more oscillators, a digital signal processor, a CODEC chipset, asubscriber identity module (SIM) card, memory, and so forth. RFcircuitry 1108 may communicate with networks, such as the Internet, alsoreferred to as the World Wide Web (WWW), an intranet and/or a wirelessnetwork, such as a cellular telephone network, a wireless local areanetwork (LAN) and/or a metropolitan area network (MAN), and otherdevices by wireless communication. The wireless communication may useany of a variety of communications standards, protocols andtechnologies, including but not limited to Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), high-speeddownlink packet access (HSDPA), high-speed uplink packet access (HSUPA),wideband code division multiple access (W-CDMA), code division multipleaccess (CDMA), time division multiple access (TDMA), Bluetooth, WirelessFidelity (Wi-Fi) (e.g., IEEE 802.11a, IEEE 802.11b, IEEE 802.11g and/orIEEE 802.11n), voice over Internet Protocol (VoIP), Wi-MAX, a protocolfor e-mail (e.g., Internet message access protocol (IMAP) and/or postoffice protocol (POP)), instant messaging (e.g., extensible messagingand presence protocol (XMPP), Session Initiation Protocol for InstantMessaging and Presence Leveraging Extensions (SIMPLE), Instant Messagingand Presence Service (IMPS)), and/or Short Message Service (SMS), or anyother suitable communication protocol, including communication protocolsnot yet developed as of the filing date of this document.

Audio circuitry 1110, speaker 1111, and microphone 1113 provide an audiointerface between a user and device 1100. Audio circuitry 1110 receivesaudio data from peripherals interface 1118, converts the audio data toan electrical signal, and transmits the electrical signal to speaker1111. Speaker 1111 converts the electrical signal to human-audible soundwaves. Audio circuitry 1110 also receives electrical signals convertedby microphone 1113 from sound waves. Audio circuitry 1110 converts theelectrical signal to audio data and transmits the audio data toperipherals interface 1118 for processing. Audio data may be retrievedfrom and/or transmitted to memory 1102 and/or RF circuitry 1108 byperipherals interface 1118. In some embodiments, audio circuitry 1110also includes a headset jack (e.g., 1212, FIG. 12). The headset jackprovides an interface between audio circuitry 1110 and removable audioinput/output peripherals, such as output-only headphones or a headsetwith both output (e.g., a headphone for one or both ears) and input(e.g., a microphone).

I/O subsystem 1106 couples input/output peripherals on device 1100, suchas touch screen 1112 and other input control devices 1116, toperipherals interface 1118. I/O subsystem 1106 may include displaycontroller 1156 and one or more input controllers 1160 for other inputor control devices. The one or more input controllers 1160 receive/sendelectrical signals from/to other input or control devices 1116. Theother input control devices 1116 may include physical buttons (e.g.,push buttons, rocker buttons, etc.), dials, slider switches, joysticks,click wheels, and so forth. In some alternate embodiments, inputcontroller(s) 1160 may be coupled to any (or none) of the following: akeyboard, infrared port, USB port, and a pointer device such as a mouse.The one or more buttons (e.g., 808, FIG. 8) may include an up/downbutton for volume control of speaker 1111 and/or microphone 1113. Theone or more buttons may include a push button (e.g., 1206, FIG. 12).

Touch-sensitive display 1112 provides an input interface and an outputinterface between the device and a user. Display controller 1156receives and/or sends electrical signals from/to touch screen 1112.Touch screen 1112 displays visual output to the user. The visual outputmay include graphics, text, icons, video, and any combination thereof(collectively termed “graphics”). In some embodiments, some or all ofthe visual output may correspond to user-interface objects.

Touch screen 1112 has a touch-sensitive surface, sensor or set ofsensors that accepts input from the user based on haptic and/or tactilecontact. Touch screen 1112 and display controller 1156 (along with anyassociated modules and/or sets of instructions in memory 1102) detectcontact (and any movement or breaking of the contact) on touch screen1112 and converts the detected contact into interaction withuser-interface objects (e.g., one or more soft keys, icons, web pages orimages) that are displayed on touch screen 1112. In an exampleembodiment, a point of contact between touch screen 1112 and the usercorresponds to a finger of the user.

Touch screen 1112 may use LCD (liquid crystal display) technology, LPD(light emitting polymer display) technology, or LED (light emittingdiode) technology, although other display technologies may be used inother embodiments. Touch screen 1112 and display controller 1156 maydetect contact and any movement or breaking thereof using any of avariety of touch sensing technologies now known or later developed,including but not limited to capacitive, resistive, infrared, andsurface acoustic wave technologies, as well as other proximity sensorarrays or other elements for determining one or more points of contactwith touch screen 1112. In an example embodiment, projected mutualcapacitance sensing technology is used, such as that found in theiPhone®, iPod Touch®, and iPad® from Apple Inc. of Cupertino, Calif.

Touch screen 1112 may have a video resolution in excess of 800 dpi. Insome embodiments, the touch screen has a video resolution ofapproximately 860 dpi. The user may make contact with touch screen 1112using any suitable object or appendage, such as a stylus, a finger, andso forth. In some embodiments, the user interface is designed to workprimarily with finger-based contacts and gestures, which can be lessprecise than stylus-based input due to the larger area of contact of afinger on the touch screen. In some embodiments, the device translatesthe rough finger-based input into a precise pointer/cursor position orcommand for performing the actions desired by the user.

In some embodiments, in addition to the touch screen, device 1100 mayinclude a touchpad (not shown) for activating or deactivating particularfunctions. In some embodiments, the touchpad is a touch-sensitive areaof the device that, unlike the touch screen, does not display visualoutput. The touchpad may be a touch-sensitive surface that is separatefrom touch screen 1112 or an extension of the touch-sensitive surfaceformed by the touch screen.

Device 1100 also includes power system 1162 for powering the variouscomponents. Power system 1162 may include a power management system, oneor more power sources (e.g., battery, alternating current (AC)), arecharging system, a power failure detection circuit, a power converteror inverter, a power status indicator (e.g., a light-emitting diode(LED)) and any other components associated with the generation,management and distribution of power in portable devices.

Device 1100 may also include one or more optical sensors or cameras1164. FIG. 11 shows an optical sensor 1164 coupled to optical sensorcontroller 1158 in I/O subsystem 1106. Optical sensor 1164 may includecharge-coupled device (CCD) or complementary metal-oxide semiconductor(CMOS) phototransistors. Optical sensor 1164 receives light from theenvironment, projected through one or more lens, and converts the lightto data representing an image. In conjunction with imaging module 1143(also called a camera module), optical sensor 1164 may capture stillimages or video. In some embodiments, an optical sensor 1164 is locatedon the back of device 1100, opposite touch screen display 1112 on thefront of the device, so that the touch screen display 1112 may be usedas a viewfinder for still and/or video image acquisition. In someembodiments, another optical sensor is located on the front of thedevice so that the user's image may be obtained for videoconferencingwhile the user views the other video conference participants on thetouch screen display.

Device 1100 may also include one or more proximity sensors 1166. FIG. 11shows proximity sensor 1166 coupled to peripherals interface 1118.Alternately, proximity sensor 1166 may be coupled to input controller1160 in I/O subsystem 1106. In some embodiments, the proximity sensor1166 turns off and disables touch screen 1112 when the multifunctiondevice 1100 is placed near the user's ear (e.g., when the user is makinga phone call).

Device 1100 includes one or more orientation sensors 1168. In someembodiments, the one or more orientation sensors 1168 include one ormore accelerometers (e.g., one or more linear accelerometers and/or oneor more rotational accelerometers). In some embodiments, the one or moreorientation sensors 1168 include one or more gyroscopes. In someembodiments, the one or more orientation sensors 1168 include one ormore magnetometers. In some embodiments, the one or more orientationsensors 1168 include one or more of global positioning system (GPS),Global Navigation Satellite System (GLONASS), and/or other globalnavigation system receivers. The GPS, GLONASS, and/or other globalnavigation system receivers may be used for obtaining informationconcerning the location and orientation (e.g., portrait or landscape) ofdevice 1100. In some embodiments, the one or more orientation sensors1168 include any combination of orientation/rotation sensors. FIG. 11shows the one or more orientation sensors 1168 coupled to peripheralsinterface 1118. Alternately, the one or more orientation sensors 1168may be coupled to an input controller 1160 in I/O subsystem 1106. Insome embodiments, information is displayed on the touch screen display1112 in a portrait view or a landscape view based on an analysis of datareceived from the one or more orientation sensors 1168.

In some embodiments, the software components stored in memory 1102include operating system 1126, communication module (or set ofinstructions) 1128, contact/motion module (or set of instructions) 1130,graphics module (or set of instructions) 1132, text input module (or setof instructions) 1134, Global Positioning System (GPS) module (or set ofinstructions) 1135, arbiter module 1158 and applications (or sets ofinstructions) 1136. Furthermore, in some embodiments memory 1102 storesdevice/global internal state 1157. Device/global internal state 1157includes one or more of: active application state, indicating whichapplications, if any, are currently active; display state, indicatingwhat applications, views or other information occupy various regions oftouch screen display 1112; sensor state, including information obtainedfrom the device's various sensors and input control devices 1116; andlocation information concerning the device's location and/or attitude.

Operating system 1126 (e.g., Darwin, RTXC, LINUX, UNIX, OS X, WINDOWS,or an embedded operating system such as VxWorks) includes varioussoftware components and/or drivers for controlling and managing generalsystem tasks (e.g., memory management, storage device control, powermanagement, etc.) and facilitates communication between various hardwareand software components.

Communication module 1128 facilitates communication with other devicesover one or more external ports 1124 and also includes various softwarecomponents for handling data received by RF circuitry 1108 and/orexternal port 1124. External port 1124 (e.g., Universal Serial Bus(USB), FIREWIRE, etc.) is adapted for coupling directly to other devicesor indirectly over a network (e.g., the Internet, wireless LAN, etc.).In some embodiments, the external port is a multi-pin (e.g., 30-pin)connector.

Contact/motion module 1130 may detect contact with touch screen 1112 (inconjunction with display controller 1156) and other touch sensitivedevices (e.g., a touchpad or physical click wheel). Contact/motionmodule 1130 includes various software components for performing variousoperations related to detection of contact, such as determining ifcontact has occurred (e.g., detecting a finger-down event), determiningif there is movement of the contact and tracking the movement across thetouch-sensitive surface (e.g., detecting one or more finger-draggingevents), and determining if the contact has ceased (e.g., detecting afinger-up event or a break in contact). Contact/motion module 1130receives contact data from the touch-sensitive surface. Determiningmovement of the point of contact, which is represented by a series ofcontact data, may include determining speed (magnitude), velocity(magnitude and direction), and/or an acceleration (a change in magnitudeand/or direction) of the point of contact. These operations may beapplied to single contacts (e.g., one finger contacts) or to multiplesimultaneous contacts (e.g., “multitouch”/multiple finger contacts). Insome embodiments, contact/motion module 1130 and display controller 1156detect contact on a touchpad.

Contact/motion module 1130 may detect a gesture input by a user.Different gestures on the touch-sensitive surface have different contactpatterns. Thus, a gesture may be detected by detecting a particularcontact pattern. For example, detecting a finger tap gesture includesdetecting a finger-down event followed by detecting a finger-up (liftoff) event at the same position (or substantially the same position) asthe finger-down event (e.g., at the position of an icon). As anotherexample, detecting a finger swipe gesture on the touch-sensitive surfaceincludes detecting a finger-down event followed by detecting one or morefinger-dragging events, and subsequently followed by detecting afinger-up (lift off) event.

Graphics module 1132 includes various known software components forrendering and displaying graphics on touch screen 1112 or other display,including components for changing the intensity of graphics that aredisplayed. As used herein, the term “graphics” includes any object thatcan be displayed to a user, including without limitation text, webpages, icons (such as user-interface objects including soft keys),digital images, videos, animations and the like.

In some embodiments, graphics module 1132 stores data representinggraphics to be used. Each graphic may be assigned a corresponding code.Graphics module 1132 receives, from applications etc., one or more codesspecifying graphics to be displayed along with, if necessary, coordinatedata and other graphic property data, and then generates screen imagedata to output to display controller 1156.

Text input module 1134, which may be a component of graphics module1132, provides soft keyboards for entering text in various applications(e.g., contacts 1137, e-mail 1140, IM 1141, browser 1147, and any otherapplication that needs text input).

GPS module 1135 determines the location of the device and provides thisinformation for use in various applications (e.g., to telephone 1138 foruse in location-based dialing, to camera 1143 as picture/video metadata,and to applications that provide location-based services such as weatherwidgets, local yellow page widgets, and map/navigation widgets).

Applications 1136 may include the following modules (or sets ofinstructions), or a subset or superset thereof:

-   -   contacts module 1137 (sometimes called an address book or        contact list);    -   telephone module 1138;    -   video conferencing module 1139;    -   e-mail client module 1140;    -   instant messaging (IM) module 1141;    -   workout support module 1142;    -   camera module 1143 for still and/or video images;    -   image management module 1144;    -   browser module 1147;    -   calendar module 1148;    -   widget modules 1149, which may include one or more of: weather        widget 1149-1, stocks widget 1149-2, calculator widget 1149-3,        alarm clock widget 1149-4, dictionary widget 1149-5, and other        widgets obtained by the user, as well as user-created widgets        1149-6;    -   widget creator module 1150 for making user-created widgets        1149-6;    -   search module 1151;    -   video and music player module 1152, which may be made up of a        video player module and a music player module;    -   notes module 1153;    -   map module 1154; and/or    -   online video module 1155.

Examples of other applications 1136 that may be stored in memory 1102include other word processing applications, other image editingapplications, drawing applications, presentation applications,JAVA-enabled applications, encryption, digital rights management, voicerecognition, and voice replication.

In conjunction with touch screen 1112, display controller 1156, contactmodule 1130, graphics module 1132, and text input module 1134, contactsmodule 1137 may be used to manage an address book or contact list (e.g.,stored in application internal state 1157), including: adding name(s) tothe address book; deleting name(s) from the address book; associatingtelephone number(s), e-mail address(es), physical address(es) or otherinformation with a name; associating an image with a name; categorizingand sorting names; providing telephone numbers or e-mail addresses toinitiate and/or facilitate communications by telephone 1138, videoconference 1139, e-mail 1140, or IM 1141; and so forth.

In conjunction with RF circuitry 1108, audio circuitry 1110, speaker1111, microphone 1113, touch screen 1112, display controller 1156,contact module 1130, graphics module 1132, and text input module 1134,telephone module 1138 may be used to enter a sequence of characterscorresponding to a telephone number, access one or more telephonenumbers in address book 1137, modify a telephone number that has beenentered, dial a respective telephone number, conduct a conversation anddisconnect or hang up when the conversation is completed. As notedabove, the wireless communication may use any of a variety ofcommunications standards, protocols and technologies.

In conjunction with RF circuitry 1108, audio circuitry 1110, speaker1111, microphone 1113, touch screen 1112, display controller 1156,optical sensor 1164, optical sensor controller 1158, contact module1130, graphics module 1132, text input module 1134, contact list 1137,and telephone module 1138, videoconferencing module 1139 includesexecutable instructions to initiate, conduct, and terminate a videoconference between a user and one or more other participants inaccordance with user instructions.

In conjunction with RF circuitry 1108, touch screen 1112, displaycontroller 1156, contact module 1130, graphics module 1132, and textinput module 1134, e-mail client module 1140 includes executableinstructions to create, send, receive, and manage e-mail in response touser instructions. In conjunction with image management module 1144,e-mail client module 1140 makes it very easy to create and send e-mailswith still or video images taken with camera module 1143.

In conjunction with RF circuitry 1108, touch screen 1112, displaycontroller 1156, contact module 1130, graphics module 1132, and textinput module 1134, the instant messaging module 1141 includes executableinstructions to enter a sequence of characters corresponding to aninstant message, to modify previously entered characters, to transmit arespective instant message (for example, using a Short Message Service(SMS) or Multimedia Message Service (MMS) protocol for telephony-basedinstant messages or using XMPP, SIMPLE, or IMPS for Internet-basedinstant messages), to receive instant messages and to view receivedinstant messages. In some embodiments, transmitted and/or receivedinstant messages may include graphics, photos, audio files, video filesand/or other attachments as are supported in a MMS and/or an EnhancedMessaging Service (EMS). As used herein, “instant messaging” refers toboth telephony-based messages (e.g., messages sent using SMS or MMS) andInternet-based messages (e.g., messages sent using XMPP, SIMPLE, orIMPS).

In conjunction with RF circuitry 1108, touch screen 1112, displaycontroller 1156, contact module 1130, graphics module 1132, text inputmodule 1134, GPS module 1135, map module 1154, and music player module1146, workout support module 1142 includes executable instructions tocreate workouts (e.g., with time, distance, and/or calorie burninggoals); communicate with workout sensors (sports devices); receiveworkout sensor data; calibrate sensors used to monitor a workout; selectand play music for a workout; and display, store and transmit workoutdata.

In conjunction with touch screen 1112, display controller 1156, opticalsensor(s) 1164, optical sensor controller 1158, contact module 1130,graphics module 1132, and image management module 1144, camera module1143 includes executable instructions to capture still images or video(including a video stream) and store them into memory 1102, modifycharacteristics of a still image or video, or delete a still image orvideo from memory 1102.

In conjunction with touch screen 1112, display controller 1156, contactmodule 1130, graphics module 1132, text input module 1134, and cameramodule 1143, image management module 1144 includes executableinstructions to arrange, modify (e.g., edit), or otherwise manipulate,label, delete, present (e.g., in a digital slide show or album), andstore still and/or video images.

In conjunction with RF circuitry 1108, touch screen 1112, display systemcontroller 1156, contact module 1130, graphics module 1132, and textinput module 1134, browser module 1147 includes executable instructionsto browse the Internet in accordance with user instructions, includingsearching, linking to, receiving, and displaying web pages or portionsthereof, as well as attachments and other files linked to web pages.

In conjunction with RF circuitry 1108, touch screen 1112, display systemcontroller 1156, contact module 1130, graphics module 1132, text inputmodule 1134, e-mail client module 1140, and browser module 1147,calendar module 1148 includes executable instructions to create,display, modify, and store calendars and data associated with calendars(e.g., calendar entries, to do lists, etc.) in accordance with userinstructions.

In conjunction with RF circuitry 1108, touch screen 1112, display systemcontroller 1156, contact module 1130, graphics module 1132, text inputmodule 1134, and browser module 1147, widget modules 1149 aremini-applications that may be downloaded and used by a user (e.g.,weather widget 1149-1, stocks widget 1149-2, calculator widget 1149-3,alarm clock widget 1149-4, and dictionary widget 1149-5) or created bythe user (e.g., user-created widget 1149-6). In some embodiments, awidget includes an HTML (Hypertext Markup Language) file, a CSS(Cascading Style Sheets) file, and a JavaScript file. In someembodiments, a widget includes an XML (Extensible Markup Language) fileand a JavaScript file (e.g., Yahoo! Widgets).

In conjunction with RF circuitry 1108, touch screen 1112, display systemcontroller 1156, contact module 1130, graphics module 1132, text inputmodule 1134, and browser module 1147, the widget creator module 1150 maybe used by a user to create widgets (e.g., turning a user-specifiedportion of a web page into a widget).

In conjunction with touch screen 1112, display system controller 1156,contact module 1130, graphics module 1132, and text input module 1134,search module 1151 includes executable instructions to search for text,music, sound, image, video, and/or other files in memory 1102 that matchone or more search criteria (e.g., one or more user-specified searchterms) in accordance with user instructions.

In conjunction with touch screen 1112, display system controller 1156,contact module 1130, graphics module 1132, audio circuitry 1110, speaker1111, RF circuitry 1108, and browser module 1147, video and music playermodule 1152 includes executable instructions that allow the user todownload and play back recorded music and other sound files stored inone or more file formats, such as MP3 or AAC files, and executableinstructions to display, present or otherwise play back videos (e.g., ontouch screen 1112 or on an external, connected display via external port1124). In some embodiments, device 1100 may include the functionality ofan MP3 player.

In conjunction with touch screen 1112, display controller 1156, contactmodule 1130, graphics module 1132, and text input module 1134, notesmodule 1153 includes executable instructions to create and manage notes,to do lists, and the like in accordance with user instructions.

In conjunction with RF circuitry 1108, touch screen 1112, display systemcontroller 1156, contact module 1130, graphics module 1132, text inputmodule 1134, GPS module 1135, and browser module 1147, map module 1154may be used to receive, display, modify, and store maps and dataassociated with maps (e.g., driving directions; data on stores and otherpoints of interest at or near a particular location; and otherlocation-based data) in accordance with user instructions.

In conjunction with touch screen 1112, display system controller 1156,contact module 1130, graphics module 1132, audio circuitry 1110, speaker1111, RF circuitry 1108, text input module 1134, e-mail client module1140, and browser module 1147, online video module 1155 includesinstructions that allow the user to access, browse, receive (e.g., bystreaming and/or download), play back (e.g., on the touch screen or onan external, connected display via external port 1124), send an e-mailwith a link to a particular online video, and otherwise manage onlinevideos in one or more file formats, such as H.264. In some embodiments,instant messaging module 1141, rather than e-mail client module 1140, isused to send a link to a particular online video.

Each of the above identified modules and applications correspond to aset of executable instructions for performing one or more functionsdescribed above and the methods described in this application (e.g., thecomputer-implemented methods and other information processing methodsdescribed herein). These modules (i.e., sets of instructions) need notbe implemented as separate software programs, procedures or modules, andthus various subsets of these modules may be combined or otherwisere-arranged in various embodiments. In some embodiments, memory 1102 maystore a subset of the modules and data structures identified above.Furthermore, memory 1102 may store additional modules and datastructures not described above.

In some embodiments, device 1100 is a device where operation of apredefined set of functions on the device is performed exclusivelythrough a touch screen and/or a touchpad. By using a touch screen and/ora touchpad as the primary input control device for operation of device1100, the number of physical input control devices (such as pushbuttons, dials, and the like) on device 1100 may be reduced.

The predefined set of functions that may be performed exclusivelythrough a touch screen and/or a touchpad include navigation between userinterfaces. In some embodiments, the touchpad, when touched by the user,navigates device 1100 to a main, home, or root menu from any userinterface that may be displayed on device 1100. In such embodiments, thetouchpad may be referred to as a “menu button.” In some otherembodiments, the menu button may be a physical push button or otherphysical input control device instead of a touchpad.

FIG. 12 depicts illustrates an example portable multifunction device1100 that may include a flex circuit for a camera with a moveable imagesensor (e.g., as described above with reference to FIGS. 1-10),according to some embodiments. The device 1100 may have a touch screen1112. The touch screen 1112 may display one or more graphics within userinterface (UI) 1200. In this embodiment, as well as others describedbelow, a user may select one or more of the graphics by making a gestureon the graphics, for example, with one or more fingers 1202 (not drawnto scale in the figure) or one or more styluses 1203 (not drawn to scalein the figure).

Device 1100 may also include one or more physical buttons, such as“home” or menu button 1204. As described previously, menu button 1204may be used to navigate to any application 1136 in a set of applicationsthat may be executed on device 1100. Alternatively, in some embodiments,the menu button 1204 is implemented as a soft key in a GUI displayed ontouch screen 1112.

In one embodiment, device 1100 includes touch screen 1112, menu button1204, push button 1206 for powering the device on/off and locking thedevice, volume adjustment button(s) 1208, Subscriber Identity Module(SIM) card slot 1210, head set jack 1212, and docking/charging externalport 1224. Push button 1206 may be used to turn the power on/off on thedevice by depressing the button and holding the button in the depressedstate for a predefined time interval; to lock the device by depressingthe button and releasing the button before the predefined time intervalhas elapsed; and/or to unlock the device or initiate an unlock process.In an alternative embodiment, device 1100 also may accept verbal inputfor activation or deactivation of some functions through microphone1113.

It should be noted that, although many of the examples herein are givenwith reference to optical sensor(s)/camera(s) 1164 (on the front of adevice), one or more rear-facing cameras or optical sensors that arepointed opposite from the display may be used instead of, or in additionto, an optical sensor(s)/camera(s) 1164 on the front of a device.

Example Computer System

FIG. 13 illustrates an example computer system 1300 that may include aflex circuit for a camera with a moveable image sensor (e.g., asdescribed above with reference to FIGS. 1-10), according to someembodiments. The computer system 1300 may be configured to execute anyor all of the embodiments described above. In different embodiments,computer system 1300 may be any of various types of devices, including,but not limited to, a personal computer system, desktop computer,laptop, notebook, tablet, slate, pad, or netbook computer, mainframecomputer system, handheld computer, workstation, network computer, acamera, a set top box, a mobile device, a consumer device, video gameconsole, handheld video game device, application server, storage device,a television, a video recording device, a peripheral device such as aswitch, modem, router, or in general any type of computing or electronicdevice.

Various embodiments of a camera motion control system as describedherein, including embodiments of magnetic position sensing, as describedherein may be executed in one or more computer systems 1300, which mayinteract with various other devices. Note that any component, action, orfunctionality described above with respect to FIGS. 1-12 may beimplemented on one or more computers configured as computer system 1300of FIG. 13, according to various embodiments. In the illustratedembodiment, computer system 1300 includes one or more processors 1310coupled to a system memory 1320 via an input/output (I/O) interface1330. Computer system 1300 further includes a network interface 1340coupled to I/O interface 1330, and one or more input/output devices1350, such as cursor control device 1360, keyboard 1370, and display(s)1380. In some cases, it is contemplated that embodiments may beimplemented using a single instance of computer system 1300, while inother embodiments multiple such systems, or multiple nodes making upcomputer system 1300, may be configured to host different portions orinstances of embodiments. For example, in one embodiment some elementsmay be implemented via one or more nodes of computer system 1300 thatare distinct from those nodes implementing other elements.

In various embodiments, computer system 1300 may be a uniprocessorsystem including one processor 1310, or a multiprocessor systemincluding several processors 1310 (e.g., two, four, eight, or anothersuitable number). Processors 1310 may be any suitable processor capableof executing instructions. For example, in various embodimentsprocessors 1310 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x86, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 1310 may commonly,but not necessarily, implement the same ISA.

System memory 1320 may be configured to store camera control programinstructions 1322 and/or camera control data accessible by processor1310. In various embodiments, system memory 1320 may be implementedusing any suitable memory technology, such as static random accessmemory (SRAM), synchronous dynamic RAM (SDRAM), nonvolatile/Flash-typememory, or any other type of memory. In the illustrated embodiment,program instructions 1322 may be configured to implement a lens controlapplication 1324 incorporating any of the functionality described above.Additionally, existing camera control data 1332 of memory 1320 mayinclude any of the information or data structures described above. Insome embodiments, program instructions and/or data may be received, sentor stored upon different types of computer-accessible media or onsimilar media separate from system memory 1320 or computer system 1300.While computer system 1300 is described as implementing thefunctionality of functional blocks of previous Figures, any of thefunctionality described herein may be implemented via such a computersystem.

In one embodiment, I/O interface 1330 may be configured to coordinateI/O traffic between processor 1310, system memory 1320, and anyperipheral devices in the device, including network interface 1340 orother peripheral interfaces, such as input/output devices 1350. In someembodiments, I/O interface 1330 may perform any necessary protocol,timing or other data transformations to convert data signals from onecomponent (e.g., system memory 1320) into a format suitable for use byanother component (e.g., processor 1310). In some embodiments, I/Ointerface 1330 may include support for devices attached through varioustypes of peripheral buses, such as a variant of the Peripheral ComponentInterconnect (PCI) bus standard or the Universal Serial Bus (USB)standard, for example. In some embodiments, the function of I/Ointerface 1330 may be split into two or more separate components, suchas a north bridge and a south bridge, for example. Also, in someembodiments some or all of the functionality of I/O interface 1330, suchas an interface to system memory 1320, may be incorporated directly intoprocessor 1310.

Network interface 1340 may be configured to allow data to be exchangedbetween computer system 1300 and other devices attached to a network1385 (e.g., carrier or agent devices) or between nodes of computersystem 1300. Network 1385 may in various embodiments include one or morenetworks including but not limited to Local Area Networks (LANs) (e.g.,an Ethernet or corporate network), Wide Area Networks (WANs) (e.g., theInternet), wireless data networks, some other electronic data network,or some combination thereof In various embodiments, network interface1340 may support communication via wired or wireless general datanetworks, such as any suitable type of Ethernet network, for example;via telecommunications/telephony networks such as analog voice networksor digital fiber communications networks; via storage area networks suchas Fibre Channel SANs, or via any other suitable type of network and/orprotocol.

Input/output devices 1350 may, in some embodiments, include one or moredisplay terminals, keyboards, keypads, touchpads, scanning devices,voice or optical recognition devices, or any other devices suitable forentering or accessing data by one or more computer systems 1300.Multiple input/output devices 1350 may be present in computer system1300 or may be distributed on various nodes of computer system 1300. Insome embodiments, similar input/output devices may be separate fromcomputer system 1300 and may interact with one or more nodes of computersystem 1300 through a wired or wireless connection, such as over networkinterface 1340.

As shown in FIG. 13, memory 1320 may include program instructions 1322,which may be processor-executable to implement any element or actiondescribed above. In one embodiment, the program instructions mayimplement the methods described above. In other embodiments, differentelements and data may be included. Note that data may include any dataor information described above.

Those skilled in the art will appreciate that computer system 1300 ismerely illustrative and is not intended to limit the scope ofembodiments. In particular, the computer system and devices may includeany combination of hardware or software that can perform the indicatedfunctions, including computers, network devices, Internet appliances,PDAs, wireless phones, pagers, etc. Computer system 1300 may also beconnected to other devices that are not illustrated, or instead mayoperate as a stand-alone system. In addition, the functionality providedby the illustrated components may in some embodiments be combined infewer components or distributed in additional components. Similarly, insome embodiments, the functionality of some of the illustratedcomponents may not be provided and/or other additional functionality maybe available.

Those skilled in the art will also appreciate that, while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 1300 may be transmitted to computer system1300 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link. Various embodiments mayfurther include receiving, sending or storing instructions and/or dataimplemented in accordance with the foregoing description upon acomputer-accessible medium. Generally speaking, a computer-accessiblemedium may include a non-transitory, computer-readable storage medium ormemory medium such as magnetic or optical media, e.g., disk orDVD/CD-ROM, volatile or non-volatile media such as RAM (e.g. SDRAM, DDR,RDRAM, SRAM, etc.), ROM, etc. In some embodiments, a computer-accessiblemedium may include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

The methods described herein may be implemented in software, hardware,or a combination thereof, in different embodiments. In addition, theorder of the blocks of the methods may be changed, and various elementsmay be added, reordered, combined, omitted, modified, etc. Variousmodifications and changes may be made as would be obvious to a personskilled in the art having the benefit of this disclosure. The variousembodiments described herein are meant to be illustrative and notlimiting. Many variations, modifications, additions, and improvementsare possible. Accordingly, plural instances may be provided forcomponents described herein as a single instance. Boundaries betweenvarious components, operations and data stores are somewhat arbitrary,and particular operations are illustrated in the context of specificillustrative configurations.

Additional descriptions of embodiments (example clauses):

Clause 1: A camera comprising: one or more optical elements; an imagesensor to capture light that has passed through the one or more opticalelements; an actuator to move the image sensor relative to the one ormore optical elements; a stationary structure; and a flex circuit,comprising: a fixed end portion fixedly attached to the stationarystructure; a moveable end portion coupled with the image sensor suchthat the moveable end portion moves with the image sensor relative tothe fixed end portion; and an intermediate portion that extends from thefixed end portion to the moveable end portion and that allows themoveable end portion to move with the image sensor, wherein theintermediate portion comprises: straight regions; and one or more bendregions at which the flex circuit bends, wherein the one or more bendregions comprise a bend region that interconnects two of the straightregions with one another; wherein the camera is configured to conveyelectrical signals between the stationary structure and the image sensorvia the flex circuit.

Clause 2: The camera of Clause 1, wherein: the bend region is a firstbend region at which the flex circuit bends about a first axis; and theone or more bend regions further comprise: a second bend region at whichthe flex circuit bends about a second axis that intersects the firstaxis.

Clause 3: The camera of Clause 2, wherein: the straight regionscomprise: a first straight region extending in a first direction; and asecond straight region extending in a second direction different fromthe first direction; and the first bend region interconnects the firststraight region with the second straight region.

Clause 4: The camera of Clause 3, wherein: the flex circuit comprisesone or more flex circuit materials; and the camera further comprises: areinforcement arrangement at the first bend region that reinforces thefirst bend region relative to each of the first straight region and thesecond straight region, the reinforcement arrangement comprising atleast one of: a contiguous strip of at least one flex circuit materialof the one or more flex circuit materials that is wider at the firstbend region than respective contiguous strips of the at least one flexcircuit material at the first straight region and the second straightregion; or an additional layer of material attached to the one or moreflex circuit materials at the bend region such that at least a portionof the bend region is thicker than each of the first straight region andthe second straight region.

Clause 5: The camera of any of Clauses 1-4, wherein: the image sensordefines a plane; and the actuator is configured to move the image sensorin directions orthogonal to the plane and parallel to the plane.

Clause 6: The camera of any of Clauses 1-5, further comprising: asubstrate attached to the image sensor; wherein: the moveable endportion of the flex circuit is attached to the substrate; and thesubstrate is configured to convey the electrical signals between themoveable end portion and the image sensor.

Clause 7: The camera of any of Clauses 1-6, wherein: the fixed endportion is a first fixed end portion positioned proximate a first sideof the camera; the flex circuit further comprises a second fixed endportion positioned proximate a second side of the camera opposite thefirst side; and the first fixed end and the second fixed end provideelectrical connections between the flex circuit and another flexcircuit.

Clause 8: A device, comprising: one or more processors; memory storingprogram instructions executable by the one or more processors to controloperation of a camera; and the camera, comprising: one or more opticalelements; an image sensor to capture light that has passed through theone or more optical elements; an actuator to move the image sensorrelative to the one or more optical elements; a stationary structurethat is stationary relative to movement of the image sensor; and a flexcircuit, comprising: a fixed end portion fixedly attached to thestationary structure; a moveable end portion coupled with the imagesensor such that the moveable end portion moves with the image sensorrelative to the fixed end portion; and an intermediate portion thatallows the moveable end portion to move with the image sensor and thatconveys electrical signals between the fixed end portion and themoveable end portion, wherein the intermediate portion comprises:straight regions; and one or more bend regions at which the flex circuitbends, wherein the one or more bend regions comprise a bend region thatinterconnects two of the straight regions with one another.

Clause 9: The device of Clause 8, wherein: the image sensor defines aplane; and the one or more processors are configured to cause theactuator to move the image sensor in directions orthogonal to the planeand parallel to the plane.

Clause 10: The device of any of Clauses 8 or 9, wherein: the bend regionis a first bend region at which the flex circuit bends about a firstaxis; and the one or more bend regions further comprise: a second bendregion at which the flex circuit bends about a second axis thatintersects the first axis; and a third bend region at which the flexcircuit bends about a third axis that is parallel to the first axis orthe second axis.

Clause 11: The device of Clause 10, wherein: the straight regionscomprise: a first straight region extending in a first direction; and asecond straight region extending in a second direction different fromthe first direction; and the first bend region interconnects the firststraight region with the second straight region.

Clause 12: The device of Clause 11, wherein: the flex circuit comprisesone or more flex circuit materials; and a contiguous strip of at leastone flex circuit material of the one or more flex circuit materials atthe first bend region is wider than respective contiguous strips of theat least one flex circuit material at the first straight region and thesecond straight region, so as to reinforce the bend region relative toeach of the first straight region and the second straight region.

Clause 13: The device of any of Clauses 11 or 12, wherein: the flexcircuit comprises one or more flex circuit materials; and the camerafurther comprises: a reinforcement layer of material attached to the oneor more flex circuit materials at the bend region such that at least aportion of the first region is thicker than at least one of the firststraight region or the second straight region.

Clause 14: The device of any of Clauses 8-13, wherein the one or moreoptical elements comprise: an optical element to fold a path of thelight before the light reaches the image sensor; wherein the imagesensor is positioned between the optical element and the moveable endportion of the flex circuit.

Clause 15: The device of any of Clauses 8-14, wherein the camera furthercomprises: a suspension arrangement that suspends the image sensor froma base structure and that allows the image sensor to move relative tothe base structure; wherein at least a portion of the flex circuit isspaced apart from the suspension arrangement.

Clause 16: A flex circuit for a camera, the flex circuit comprising: afixed end portion to attach to a stationary structure of the camera; amoveable end portion to couple with a moveable image sensor of thecamera, wherein an actuator of the camera is to move the moveable imagesensor relative to one or more optical elements of the camera; and anintermediate portion to convey electrical signals between the fixed endportion and the moveable end portion, the intermediate portioncomprising: a first straight region extending in a first direction; asecond straight region extending in a second direction different fromthe first direction; and a bend region interconnecting the firststraight region with the second straight region; wherein theintermediate portion is to allow the moveable end portion to move withthe image sensor.

Clause 17: The flex circuit of Clause 16, wherein a portion of the firststraight region splits into multiple legs that extend in parallel in thefirst direction.

Clause 18: The flex circuit of Clause 17, wherein: the first straightregion comprises a wider portion extending between the moveable endportion and the multiple legs, the wider portion comprising a fan-out ofelectrical signal traces from the moveable end portion; and theelectrical signal traces are routed to the fixed end portion via one ormore of the multiple legs.

Clause 19: The flex circuit of any of Clauses 16-18, wherein: the fixedend portion is a first fixed end portion to attach proximate a firstside of the camera; and the flex circuit further comprises: a secondfixed end portion to attach proximate a second side of the camera, thesecond side opposite the first side.

Clause 20: The flex circuit of any of Clauses 16-19, wherein theintermediate portion extends along at least three planes that intersectwith one another, each of the planes corresponding to a respectivedegree of freedom so as to allow the moveable end portion to move alongat least three axes.

Clause 21: A camera, comprising: one or more optical elements; an imagesensor; an actuator to move the image sensor relative to the one or moreoptical elements; a flex circuit, formed of one or more flex circuitmaterials, to convey electrical signals between the image sensor and astationary structure of the camera, wherein the flex circuit comprises:a first straight region; a second straight region; and a bend regionextending from the first straight region to the second straight region;and wherein the flex circuit is configured such that motion of the imagesensor enabled by the actuator causes the first straight region to moverelative to the second straight region; and a reinforcement layer ofmaterial coupled with the one or more flex circuit materials at the bendregion, to stiffen the bend region relative to an unreinforced portionof at least one of the first straight region or the second straightregion.

Clause 22: The camera of Clause 21, wherein: a first portion of thereinforcement layer of material overlaps with a surface of the flexcircuit; and a second portion of the reinforcement layer of materialextends from the first portion past a footprint of the flex circuit,such that the second portion does not overlap with the surface.

Clause 23: The camera of Clause 22, wherein: the second portion of thereinforcement layer of material extends from the first portion past thefootprint of the flex circuit in a first direction; and a third portionof the reinforcement layer of material extends from the first portionpast the footprint of the flex circuit in a second direction orthogonalto the first direction.

Clause 24: The camera of any of Clauses 21-23, wherein the reinforcementlayer of material comprises plastic.

Clause 25: The camera of any of Clauses 21-23, wherein the reinforcementlayer of material comprises a metallic alloy.

Clause 26: The camera of Clause 25, wherein the metallic alloy comprisesat least one of: aluminum; brass; or stainless steel.

Clause 27: The camera of any of Clauses 21-26, wherein the flex circuitcomprises: a fixed end portion fixedly attached to the stationarystructure; a moveable end portion coupled with the image sensor suchthat the moveable end portion moves with the image sensor relative tothe fixed end portion; and an intermediate portion that allows themoveable end portion to move with the image sensor and that conveyselectrical signals between the fixed end portion and the moveable endportion, wherein the intermediate portion comprises: the first straightregion; the second straight region; and the bend region.

Clause 28: The camera of Clause 27, wherein: the bend region is a firstbend region; the first straight region is a first contiguous leg of theflex circuit that extends, in a first direction parallel to an imageplane defined by the image sensor, from the moveable end portion to thefirst bend region; the second straight region is a second contiguous legof the flex circuit that extends, in a second direction different thanthe first direction, from a second bend region of the flex circuit to athird bend region of the flex circuit; and the first bend region and thefirst straight region are centered, in the second direction, between thesecond bend region and the third bend region.

Clause 29: A device, comprising: one or more processors; memory storingprogram instructions executable by the one or more processors to controloperation of a camera; and the camera, comprising: one or more opticalelements; an image sensor; an actuator to move the image sensor relativeto the one or more optical elements; a flex circuit, formed of one ormore flex circuit materials, to convey electrical signals between theimage sensor and a stationary structure of the camera, wherein the flexcircuit comprises: a first straight region; a second straight region;and a bend region extending from the first straight region to the secondstraight region; and wherein the flex circuit is configured such thatmotion of the image sensor enabled by the actuator causes the firststraight region to move relative to the second straight region; and areinforcement layer of material coupled with the one or more flexcircuit materials at the bend region, to stiffen the bend regionrelative to an unreinforced portion of at least one of the firststraight region or the second straight region.

Clause 30: The device of Clause 29, wherein the first straight region ofthe flex circuit comprises a stack of layers, and wherein the stack oflayers comprises: electrical traces formed of a conductive material; anda photosensitive polyimide (PI) layer adjacent the electrical traces.

Clause 31: The device of Clause 30, wherein the stack of layers furthercomprises: a dielectric layer adjacent the photosensitive PI layer andadjacent the electrical traces; wherein: the photosensitive PI layercomprises photosensitive liquid PI; and the electrical traces are atleast partially embedded within the photosensitive PI layer.

Clause 32: The device of any of Clauses 29-31, wherein: thereinforcement layer is a base layer that is integrally formed in a samestack of layers as the flex circuit.

Clause 33: The device of Clause 32, wherein the stack of layers furthercomprises: a dielectric layer adjacent the base layer; and electricaltraces formed of a conductive material, wherein portions of the baselayer are etched away to define an outer periphery of the reinforcementlayer and expose portions of the dielectric layer.

Clause 34: The device of Clause 33, wherein the stack of layers does notinclude an adhesive layer between the base layer and the dielectriclayer.

Clause 35: The device of any of Clauses 29-34, wherein the reinforcementlayer is formed of at least one of copper or stainless steel.

Clause 36: The device of any of Clauses 29-35, wherein: a first portionof the reinforcement layer of material overlaps with a surface of theflex circuit; and a second portion of the reinforcement layer ofmaterial extends from the first portion past a footprint of the flexcircuit, such that the second portion does not overlap with the surface.

Clause 37: The device of any of Clauses 29-36, wherein: the bend regionis a first bend region at which the flex circuit bends about a firstaxis; the reinforcement layer of material is a first reinforcement layerof material; the flex circuit further comprises a second bend region atwhich the flex circuit bends about a second axis that intersects thefirst axis; and the camera further comprises: a second reinforcementlayer of material coupled with the one or more flex circuit materials atthe second bend region, to stiffen the second bend region relative tothe unreinforced portion.

Clause 38: The device of any of Clauses 29-37, wherein: the image sensordefines an image plane; and the one or more processors are configured tocause the actuator to move the image sensor in directions orthogonal tothe image plane and parallel to the image plane.

Clause 39: A method, comprising: forming a stack of layers that includesa flex circuit to convey electrical signals between an image sensor anda stationary structure of a camera, wherein the flex circuit comprises:a first straight region; a second straight region; and a bend regionextending from the first straight region to the second straight region;wherein: the flex circuit is configured such that motion of the imagesensor enabled by an actuator of the camera causes the first straightregion to move relative to the second straight region; and the stack oflayers comprises: a reinforcement base layer; a dielectric layeradjacent the reinforcement base layer; and electrical traces formed of aconductive material; and removing, using one or more subtractivemanufacturing processes, portions of the reinforcement base layer toexpose portions of the dielectric layer and to define an outer peripheryof a reinforcement layer of material at the bend region, wherein thereinforcement layer of material stiffens the bend region relative to theportions of the dielectric layer that are exposed.

Clause 40: The method of Clause 39, wherein the forming the stack oflayers further comprises: coating the electrical traces and thedielectric layer with a photosensitive liquid polyimide (PI) layer,wherein the photosensitive liquid PI layer and the reinforcement baselayer are positioned on opposite sides of the dielectric layer.

Other allocations of functionality are envisioned and may fall withinthe scope of claims that follow. Finally, structures and functionalitypresented as discrete components in the example configurations may beimplemented as a combined structure or component. These and othervariations, modifications, additions, and improvements may fall withinthe scope of embodiments as defined in the claims that follow.

What is claimed is:
 1. A camera, comprising: one or more opticalelements; an image sensor; an actuator to move the image sensor relativeto the one or more optical elements; a flex circuit, formed of one ormore flex circuit materials, to convey electrical signals between theimage sensor and a stationary structure of the camera, wherein the flexcircuit comprises: a first straight region; a second straight region;and a bend region extending from the first straight region to the secondstraight region; and wherein the flex circuit is configured such thatmotion of the image sensor enabled by the actuator causes the firststraight region to move relative to the second straight region; and areinforcement layer of material coupled with the one or more flexcircuit materials at the bend region, to stiffen the bend regionrelative to an unreinforced portion of at least one of the firststraight region or the second straight region.
 2. The camera of claim 1,wherein: a first portion of the reinforcement layer of material overlapswith a surface of the flex circuit; and a second portion of thereinforcement layer of material extends from the first portion past afootprint of the flex circuit, such that the second portion does notoverlap with the surface.
 3. The camera of claim 2, wherein: the secondportion of the reinforcement layer of material extends from the firstportion past the footprint of the flex circuit in a first direction; anda third portion of the reinforcement layer of material extends from thefirst portion past the footprint of the flex circuit in a seconddirection orthogonal to the first direction.
 4. The camera of claim 1,wherein the reinforcement layer of material comprises plastic.
 5. Thecamera of claim 1, wherein the reinforcement layer of material comprisesa metallic alloy.
 6. The camera of claim 5, wherein the metallic alloycomprises at least one of: aluminum; brass; or stainless steel.
 7. Thecamera of claim 1, wherein the flex circuit comprises: a fixed endportion fixedly attached to the stationary structure; a moveable endportion coupled with the image sensor such that the moveable end portionmoves with the image sensor relative to the fixed end portion; and anintermediate portion that allows the moveable end portion to move withthe image sensor and that conveys electrical signals between the fixedend portion and the moveable end portion, wherein the intermediateportion comprises: the first straight region; the second straightregion; and the bend region.
 8. The camera of claim 7, wherein: the bendregion is a first bend region; the first straight region is a firstcontiguous leg of the flex circuit that extends, in a first directionparallel to an image plane defined by the image sensor, from themoveable end portion to the first bend region; the second straightregion is a second contiguous leg of the flex circuit that extends, in asecond direction different than the first direction, from a second bendregion of the flex circuit to a third bend region of the flex circuit;and the first bend region and the first straight region are centered, inthe second direction, between the second bend region and the third bendregion.
 9. A device, comprising: one or more processors; memory storingprogram instructions executable by the one or more processors to controloperation of a camera; and the camera, comprising: one or more opticalelements; an image sensor; an actuator to move the image sensor relativeto the one or more optical elements; a flex circuit, formed of one ormore flex circuit materials, to convey electrical signals between theimage sensor and a stationary structure of the camera, wherein the flexcircuit comprises: a first straight region; a second straight region;and a bend region extending from the first straight region to the secondstraight region; and wherein the flex circuit is configured such thatmotion of the image sensor enabled by the actuator causes the firststraight region to move relative to the second straight region; and areinforcement layer of material coupled with the one or more flexcircuit materials at the bend region, to stiffen the bend regionrelative to an unreinforced portion of at least one of the firststraight region or the second straight region.
 10. The device of claim9, wherein the first straight region of the flex circuit comprises astack of layers, and wherein the stack of layers comprises: electricaltraces formed of a conductive material; and a photosensitive polyimide(PI) layer adjacent the electrical traces.
 11. The device of claim 10,wherein the stack of layers further comprises: a dielectric layeradjacent the photosensitive PI layer and adjacent the electrical traces;wherein: the photosensitive PI layer comprises photosensitive liquid PI;and the electrical traces are at least partially embedded within thephotosensitive PI layer.
 12. The device of claim 9, wherein: thereinforcement layer is a base layer that is integrally formed in a samestack of layers as the flex circuit.
 13. The device of claim 12, whereinthe stack of layers further comprises: a dielectric layer adjacent thebase layer; and electrical traces formed of a conductive material;wherein portions of the base layer are etched away to define an outerperiphery of the reinforcement layer and expose portions of thedielectric layer.
 14. The device of claim 13, wherein the stack oflayers does not include an adhesive layer between the base layer and thedielectric layer.
 15. The device of claim 13, wherein the reinforcementlayer is formed of at least one of copper or stainless steel.
 16. Thedevice of claim 9, wherein: a first portion of the reinforcement layerof material overlaps with a surface of the flex circuit; and a secondportion of the reinforcement layer of material extends from the firstportion past a footprint of the flex circuit, such that the secondportion does not overlap with the surface.
 17. The device of claim 9,wherein: the bend region is a first bend region at which the flexcircuit bends about a first axis; the reinforcement layer of material isa first reinforcement layer of material; the flex circuit furthercomprises a second bend region at which the flex circuit bends about asecond axis that intersects the first axis; and the camera furthercomprises: a second reinforcement layer of material coupled with the oneor more flex circuit materials at the second bend region, to stiffen thesecond bend region relative to the unreinforced portion.
 18. The deviceof claim 9, wherein: the image sensor defines an image plane; and theone or more processors are configured to cause the actuator to move theimage sensor in directions orthogonal to the image plane and parallel tothe image plane.
 19. A method, comprising: forming a stack of layersthat includes a flex circuit to convey electrical signals between animage sensor and a stationary structure of a camera, wherein the flexcircuit comprises: a first straight region; a second straight region;and a bend region extending from the first straight region to the secondstraight region; wherein: the flex circuit is configured such thatmotion of the image sensor enabled by an actuator of the camera causesthe first straight region to move relative to the second straightregion; and the stack of layers comprises: a reinforcement base layer; adielectric layer adjacent the reinforcement base layer; and electricaltraces formed of a conductive material; and removing, using one or moresubtractive manufacturing processes, portions of the reinforcement baselayer to expose portions of the dielectric layer and to define an outerperiphery of a reinforcement layer of material at the bend region,wherein the reinforcement layer of material stiffens the bend regionrelative to the portions of the dielectric layer that are exposed. 20.The method of claim 19, wherein the forming the stack of layers furthercomprises: coating the electrical traces and the dielectric layer with aphotosensitive liquid polyimide (PI) layer, wherein the photosensitiveliquid PI layer and the reinforcement base layer are positioned onopposite sides of the dielectric layer.